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Boron nitride (BN) powder
Boron nitride, known as "white graphite," generally has a layered structure similar to graphite and is an excellent material for lubrication and release properties. While graphite has electrical conductivity, boron nitride possesses electrical insulation properties and boasts excellent characteristics such as chemical stability and thermal stability. *You can view the properties table by downloading it.*
Hexagonal boron nitride powder with the highest level of thermal conductivity of 400 W/mK (in the horizontal direction) and electrical insulation properties.
Boron nitride is a heat dissipation material that combines the highest level of thermal conductivity at 400 W/mK (in the horizontal direction) with electrical insulation properties. 【Features】 ■ Has a highly crystalline layered structure suitable for heat dissipation materials ■ Combines excellent heat dissipation performance with electrical insulation properties ■ Usable in a wide range of applications 3M's boron nitride is particularly noted for its rich lineup and the variety of combinations available, which has received positive feedback. In addition to the common hexagonal shapes, there are also aggregate types and granulated types, allowing for selection based on the desired performance. *For more details, please refer to the PDF document or feel free to contact us.
Introducing boron nitride with excellent thermal conductivity. Achieving void-free formation through a special manufacturing process! 【Balancing low dielectric and high heat dissipation】
Our company's "HP-40 Series Boron Nitride Powder for Electronic Materials" is suitable for applications that require strict insulation properties and excellent heat dissipation characteristics, such as power modules. It is used as a high thermal conductivity filler in heat dissipation sheets and metal-based substrates, utilizing an aggregated filler that eliminates the anisotropy of boron nitride. It is implemented in products with thermal conductivity of 12 W/mk or higher, and is currently being developed at levels of 15 to 20 W/mk. We have achieved high filling in thermosetting resins such as epoxy resin, polyimide, and acrylic resin, balancing low dielectric properties and high thermal conductivity for the upcoming 5G and 6G communications. In addition to excellent insulation and uniform dispersion, it possesses stable performance characteristics such as moderate aggregation strength. We are also happy to provide additional suggestions, so please refer to the PDF materials for more details or feel free to contact us.
